規格概要
Specification Overview
Reference overview. Full details are provided per project.
SPECIFICATIONS · 規格
Reference Specifications
| Item 項目 | Reference 參考 |
|---|---|
| Layers 層數 | Rigid boards: 1–10 L for mass production; up to 16 L for samples |
| Board thickness 板厚 | 0.25 – 4.6 mm |
| Copper weight 銅厚 | Up to 6 oz |
| Base material 板材 | FR-4, Tg 140 – 250; halogen-free available |
| Impedance control 阻抗控制 | Available 可提供 |
| Flex / Rigid-Flex 軟板／軟硬複合板 | Quoted per project 依專案確認 |
Values are reference only; final feasibility is confirmed per design and quotation.
以上為參考資料，實際可行性依設計與報價確認。
Surface Finish 表面處理
HASL噴錫ENIG沉金OSP抗氧化Immersion Silver沉銀Immersion Tin沉錫Hard Gold / Gold Finger電鍍金／金手指
ON REQUEST · 洽談提供
Provided per Project
Detailed Specifications 詳細規格
Full process parameters, confirmed against your design.
Lead Time 交期
Depends on layer count, quantity and board type.
Test & Inspection Reports 檢驗報告
Provided per order where applicable.
Certification Documents 認證文件
Available to qualified customers on request.
Payment Terms 付款條件
Confirmed per order.
Quality system of our rigid-PCB partner is certified to IATF 16949:2016.
硬板製造夥伴的品質管理系統通過 IATF 16949:2016 認證。